Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Abstract: Combining antenna arrays with physical reconfigurability (i.e., origami) allows for additional degrees of freedom in operation and enables larger structures to be folded into smaller volumes ...
WASHINGTON — Teeing up a blockbuster ruling, the Supreme Court on Friday agreed to decide the lawfulness of President Donald Trump’s contentious plan to roll back automatic birthright citizenship for ...
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