Digital Storage And Memory Feeds AI At The 2026 CES

The 2026 CES featured lots of digital storage and memory technologies including SSDs, NAS products, DRAM and HBM as well as ...

Micron: America's Fortress In The Global AI Memory War

Micron Technology, Inc. is positioned to benefit from the AI supercycle and U.S. digital infrastructure expansion. Learn more ...

Kingston Dual Portable flash drive review: Competitive performance, dual connectors

With anything up to a couple hundred gigabytes of data, the Kingston 10Gbps Dual Portable flash drive performs very well. But ...
Tech Xplore

AI gobbling up memory chips essential to gadget makers

As devices from toys to cars get smarter at the Consumer Electronics Show, gadget makers are grappling with a shortage of ...
IEEE

A Through Silicon Via (TSV) Architecture of the Bumpless Build Cube (BBCube) for Stacked Memory Devices

Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
IEEE

Selecting Device, In-Memory Search, and Monolithic 3D Integration of RRAMs and 2D Devices Towards High Reliability and High Efficiency: (Invited Paper)

Abstract: Resistive random-access memories (RRAMs) are highly promising for high-density memory and energy-efficient inmemory computing. Towards the integration of RRAM arrays, the sneak path leakage ...