Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today unveiled its SRG091X and SRG093X series modules at CES in Las Vegas, delivering integrated CPU, memory and wireless ...

Award-winning author reframes food as the most intimate human-scale interface for understanding how AI reshapes imagination, perception, and sensory cognition. AI is restructuring how imagination is ...

Astera Labs and Marvell are poised to gain from surging memory prices via memory controllers. See more on ALAB and MRVL stock ...

Macronix International Co., Ltd. (TSE: 2337), a leading integrated device manufacturer in the non-volatile memory (NVM) market, today announced the high-performance and efficiency MXSMIO™ family of ...

Samsung last month unveiled a SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms.

Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical ...

TSMC has shown off its next step in high-bandwidth memory integration, introducing custom C-HBM4E stacks paired with new N3P-based logic dies. The company is clearly positioning these components for ...

An AMD patent application for a new spin on DDR5 PC memory has been spotted. The so-called high-bandwidth dual inline memory module or HB-DIMM is designed to boost memory bandwidth courtesy of pseudo ...

These MXC chips comply with JEDEC specifications for both DDR4 and DDR5 memory. The mass-produced MXC Gen1 chips support CXL 2.0 with DDR4-3200/DDR5-5600, while the MXC Gen2 chips support CXL 2.0 and ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Introduces industry-leading LPDDR5 CAMM2 PMIC and DDR5 Gen 2 Client PMIC alongside Client Clock Driver and SPD Hub for high-performance notebooks, desktops and workstations Supports wide range of ...