Semiconductor Engineering

Sparse Finite Element Problems on Neuromorphic HW (Sandia National Lab)

A new technical paper titled “Solving sparse finite element problems on neuromorphic hardware” was published by researchers ...
IEEE

Thermal and Mechanical Finite Element Analysis of Stacking Co-packaged GaN/SiC Device

Abstract: This paper presents an innovative packaging design for a gallium nitride (GaN) high electron mobility transistor/silicon carbide (SiC) junction field effect transistor cascode device. Finite ...
Semiconductor Engineering

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
IEEE

Numerical Simulation of Flexible Pavement Using Finite Element Method: Global Sensitivity Analysis

Abstract: The integrity and longevity of road infrastructure are critical for ensuring safe and efficient transportation. How-ever, road deterioration is a pervasive issue, exacerbated by the ...