Abstract: An innovative 3D stackable wing-shaped Via RRAM is firstly proposed, featuring logic embedded ultra-high memory density (>0.1Gb/mm 2) and full compatibility with TSMC’s 16nm FinFET CMOS ...
With a culinary degree and nearly 20 years of food-writing experience, Jason Horn has spent his entire career covering food and drinks. He's Food & Wine's resident knife expert and has tested hundreds ...
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