Abstract: The design of high-performance electrical machines necessitates the intricate integration of multiple physical domains, including electromagnetic, mechanical, and thermal aspects. To meet ...
Siemens unveils industrial metaverse technology, delivering industrial intelligence, by joining physical AI with a ...
Abstract: The emerging 3D-IC systems, enabled by advanced packaging techniques, promise high integration density and manufacturing yield to keep Moore's Law thriving. However, due to the complexity of ...
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