Abstract: This paper presents the design and layout of a high speed folded cascode operational amplifier with the minimum layout area in SCL 180nm CMOS technology. The analog circuits are more ...
A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
Abstract: This paper outlines the establishment of a generic cryogenic CMOS database in which key electrical parameters and transfer characteristics of the MOSFETs are quantified as functions of ...
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