Abstract: SiC devices possess characteristics such as high voltage resistance, low loss, and high thermal conductivity, making them highly advantageous for applications in smart grids, new energy ...

Ascentiz, a pioneer in wearable robotics, today introduced its groundbreaking modular exoskeleton system at CES 2026. The ...

Abstract: Embedded packaging of wide-bandgap (WBG) power modules offers an inherently lower parasitic inductance, higher switching frequency, and lower power losses compared to traditional ...

CES turns Las Vegas into the epicenter of the tech world every January, bringing together industry giants and scrappy ...