Abstract: Reliability is a critical performance metric for power semiconductor switches and power electronic systems. Yet guidance on how to test and quantify that reliability is fragmented in the ...
Abstract: In this study, a micro tensile test method that can measure the interface strength of a grain boundary has been developed by applying an EBSD (Electron Back-Scatter Diffraction) method and a ...
The tensile testing machine described here is a fully open-source device designed to determine the mechanical tensile strength of test specimens. At its core, it uses a single-board computer ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback