Researchers from the Faculty of Engineering at The University of Hong Kong (HKU) have made a significant discovery regarding ...
Physicists at the University of Oxford have contributed to a new study which has found that iron-rich asteroids can tolerate ...
Abstract: In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is ...
Abstract: Direct wafer bonding technology is used in a growing number of semiconductor applications to meet device scaling challenges. Tight bonded wafer distortion requirements are needed to ensure ...