A dev on Minecraft-like Hytale has already used its creative tools to make a homebrew side-scroller

Even Hytale, the long-awaited, standalone Minecraft-like due to release into early access Jan. 13, can have its origins ...
IEEE

Die-Level Transformation From 2D Shuttle Chips to 3D-IC With TSV for Advanced Rapid Prototyping Methodology With Meta Bonding

Abstract: 3D-IC technology, it may be more appropriate to refer to this as TSV (Through-Si Via) formation technology, has been maturing year by year and is increasingly utilized in advanced ...
IEEE

Selecting Device, In-Memory Search, and Monolithic 3D Integration of RRAMs and 2D Devices Towards High Reliability and High Efficiency: (Invited Paper)

Abstract: Resistive random-access memories (RRAMs) are highly promising for high-density memory and energy-efficient inmemory computing. Towards the integration of RRAM arrays, the sneak path leakage ...