Abstract: Three-dimensional stacked integration based on through-silicon via (TSV) meets the high-speed development requirements of integrated circuits (ICs). However, TSV is a sensitive unit prone to ...

Abstract: High-temperature superconducting (HTS) generators that functions in combination with a hydrogen gas turbine have the potential to reduce CO2 emissions in Japan. The system can realize ...

Infeasible paths constitute a bottleneck for the complete automation of software testing, one of the most expensive activities of software quality assurance. Research efforts have been spent on ...

This is a command line program. Launch from a Windows command window: I have seen some issues with Windows Terminal app (issues with scrolling through fast messages, occasional crashing), so if you ...