IEEE

Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging

Abstract: Coefficients of thermal expansion (CTE) of various materials in packaging structure layers vary largely, causing significant thermomechanical stress in power electronic packages during ...
IEEE

Research on the Shanghai-Hong Kong Stock Connect mechanism and corporate capital structure:Empirical evedence based on the model of DID

Abstract: The influence of stock market liberalization on the capital structure of listed companies has been a hot topic. From the perspective of the capital structure of companies, this paper ...
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PATEO CONNECT technology sets out board and committee structure

PATEO CONNECT Technology (Shanghai) Corporation Class H ( (HK:2889)) has shared an update. PATEO CONNECT Technology (Shanghai) Corporation, listed in Hong Kong under stock code 2889, is a joint stock ...