BISC is an ultra-thin neural implant that creates a high-bandwidth wireless link between the brain and computers. Its tiny single-chip design packs tens of thousands of electrodes and supports ...
Abstract: The integration of radar sensing and imaging capabilities into future integrated sensing and communication (ISAC) networks enables advanced use cases, including autonomous vehicle navigation ...
SHENZHEN, China — The tech company SiCarrier is hardly a household name. The government-backed Chinese firm makes things most people have probably never heard of, like epitaxy equipment and atomic ...
Abstract: It is well known that inclined sidewall scattering structures can improve the light extraction efficiency (LEE) of micro deep ultraviolet (DUV) light-emitting diodes (LEDs). However, ...
The Trump administration has launched an interagency review to determine whether to authorize the first exports of Nvidia's H200 artificial intelligence chips to China, Reuters reported. Save my User ...
WASHINGTON, Dec 18 (Reuters) - U.S. President Donald Trump's administration has launched a review that could result in the first shipments to China of Nvidia's second-most powerful AI chips, five ...
Rep. Chip Roy (R-Texas) on Tuesday slammed a deal that Rep. Marjorie Taylor Greene (R-Ga.) said she made with House GOP leadership that resulted in a promise of a Wednesday vote for an ...
Breakthroughs, discoveries, and DIY tips sent every weekday. Terms of Service and Privacy Policy. “Cooking is art—but baking is science,” Bill Nye the Science ...
Current political and economic issues succinctly explained. On December 8, the Trump administration announced plans to loosen U.S. export controls on artificial intelligence (AI) chips to China by ...
Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.
To test the new chips, the researchers used a special machine, like the one pictured here, to perform automated electrical characterization of the designs on a wafer of chips.Bella Ciervo, Penn ...
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