SAN DIEGO, CA, UNITED STATES, January 5, 2026 /EINPresswire.com/ — Silanna Semiconductor today announced it has integrated a feature-rich DSP into its Plural™ family of high-speed, low-power ADCs. All ...
Chiplets enable scalability but dramatically raise interconnect complexity and risk. Silicon-proven NoC technology is the key ...
Silanna Semiconductor has announced it has integrated a feature-rich DSP into its Plural family of high-speed, low-power ADCs ...
A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
Continuing his reverse-engineering of the Intel 8087, [Ken Shirriff] covers the conditional tests that are implemented in the microcode of this floating point processing unit (FPU). This microcode ...