Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms SAN ...
Ryzen AI Embedded processors provide a development environment with a unified software stack that spans the CPU, GPU, and NPU. At the runtime layer, developers benefit from optimized CPU libraries, ...
Abstract: Embedded packaging of wide-bandgap (WBG) power modules offers an inherently lower parasitic inductance, higher switching frequency, and lower power losses compared to traditional ...
Abstract: The escalating integration level of system-in-package (SiP) has brought about significant challenges in thermal management. To meet the requirements of ever-increasing heat flux of SiP ...
News Highlights New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and ...