Abstract: Energy efficiency has become an important concern in software engineering today. At the same time, since generative AI tools have got deeply integrated into coding workflows, it has become ...
Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Author Shawn Peters blends clarity and rigor to make data structures and algorithms accessible to all learners. COLORADO, CO, UNITED STATES, January 2, 2026 /EINPresswire.com/ — Vibrant Publishers ...
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