Where were you in 1996? Were you at the start of your career in the electrical industry or a seasoned expert in your prime? Regardless of where that year found you in your professional life, one thing ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

How the challenges of electric-motor control design can be overcome using digital twins in all design and test phases. How automated testing within a continuous and integrated toolchain is able to ...

ICs for automotive applications must satisfy long-term reliability requirements by being insensitive to hard electromechanical stresses. Recently, some studies revealed that the long term robustness ...

The 2023 edition of NFPA 70B saw it converted from a recommended practice to the Standard for Electrical Equipment Maintenance. This NFPA 70B update will continue to work in conjunction with ANSI/NETA ...