Abstract: This article introduces a low-cost, easy-to-manufacture, dual polarization reconfigurable reflectarray antenna based on liquid crystal (LC) that operates at W-band. The antenna is ...
Abstract: 3D integration by adopting wafer-to-wafer (W2W) or chip-to-wafer (C2W) direct bonding techniques scales up interconnect density. Heterogenous integration enabled by direct bonding technology ...
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