Abstract: With the development of the semiconductor industry, more advanced electronic packaging solutions are being developed for improved manufacturing processes. The sparse Ball Grid Array (BGA) ...
Abstract: This article presents a physics-enhanced equivalent circuit model for high-frequency interconnections integrating ball grid arrays (BGAs) with redistribution layers (RDLs), fabricated using ...
You'll never make the old kind again. It will be hard not to eat all these delightful million-dollar sausage balls in one sitting. The smoky Gouda, paired with the hot sausage, is a match made in ...
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