Abstract: This article presents the D-band characterization of General Electric’s (GE) high-purity fused-silica (HPFS) substrate processing using microstrip ring resonator (MRR) and required passive ...
Abstract: In sub 10 nm nodes, the growing dominance of interconnects in chips poses challenges in designing large-size static random-access memory (SRAM) subarrays. The main issue is the write failure ...
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