This 3D artist’s favourite way to practise without blank-page panic

As such, Roumen doesn't hold back on the software he's happy to embrace, which includes the works all the best 3D modelling ...
IEEE

Die-Level Transformation From 2D Shuttle Chips to 3D-IC With TSV for Advanced Rapid Prototyping Methodology With Meta Bonding

Abstract: 3D-IC technology, it may be more appropriate to refer to this as TSV (Through-Si Via) formation technology, has been maturing year by year and is increasingly utilized in advanced ...