The power electronics industry and the semiconductor industry, inseparably intertwined with one another, are facing unprecedented efficiency, cost, construction and thermal challenges which provide ...
Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...
The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...
In power supply design, reducing physical size while improving conversion efficiency is a sort of Holy Grail. The payoff for success is a potentially smaller overall system design, complemented by ...
Liquid-Crystal Polymer Meets the Challenges of RF Power Packaging The plastic air-cavity packages are hermetically sealed using a proprietary process A material used in a proprietary process addresses ...
Brian Narveson, Independent Consultant and PSMA Board Member, and Greg Evans, CEO, WelComm Inc., and PSMA Marketing Committee, contributed to this article. It’s always been inevitable, that in system ...
With the advent of the Internet and multimedia, electronics miniaturization in the form of integrated circuits has become an indispensable part of our lives. To ensure its long-term operation and ...
More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...
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