SEOUL, South Korea--(BUSINESS WIRE)--DB HiTek had announced to expand the RF front-end business by securing RF SOI (Silicon-on-Insulator) and RF HRS (High Resistivity Substrate) process based on 130nm ...

A new technical paper titled “Lateral Tunnel Epitaxy of GaAs in Lithographically Defined Cavities on 220 nm Silicon-on-Insulator” was published by researchers at Cardiff University and University of ...

If you are a part of the semiconductor industry or simply someone interested in the field, you have likely heard what has become a common refrain: the back-end of the process is becoming more like the ...

It’s a common refrain in today’s marketplace: Qualified tech professionals have a lot of choices when it comes to their careers, and the competition for securing top tech talent keeps getting tougher ...

MELVILLE, N.Y., April 8, 2021 /PRNewswire/ — Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has launched the FPA-5520iV LF Option for ...

Semiconductor devices are now universal and have a critical role in modern-day society. Semiconductors influence how we provide entertainment, interact and communicate with the world, and enable many ...

3D optical profiling provides many benefits over other measurement methods used for non-contact inspection of semiconductor packaging front-end process research and control. These benefits range from ...

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