The MarketWatch News Department was not involved in the creation of this content. TAICHUNG, Taiwan, Dec. 11, 2025 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of ...
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Micron stock hits record high as Bernstein sees biggest price upcycle driving memory boom — retail calls it 'cheap'
Bernstein raised its price target to $330, flagging accelerating memory price hikes. ・AI-led demand for HBM and DRAM is ...
China's leading maker of dynamic random access memory (DRAM) chips, ChangXin Memory Technologies Corp (CXMT), says it plans ...
TAIPEI (Taiwan News) — Asus said Friday it has no plans to invest in DRAM manufacturing, dismissing speculation triggered by ...
Samsung has revealed that it has created the world’s first 24GB GDDR7 DRAM memory chip, which is designed for high-performance GPUs (graphics processing units). This new memory chip is not only the ...
Winbond Electronics has kicked off mass production of specialty DRAM memory using 20nm process technology, with plans to transition to a newer 16nm process, according to the Taiwan-based chipmaker.
Advanced process nodes and higher silicon densities are heightening DRAM’s susceptibility to Rowhammer attacks, as reduced cell spacing significantly decreases the hammer count needed for bit flips.
HBM (High Bandwidth Memory) refers to a stack of multiple DRAM chips vertically arranged, which considerably amplifies data processing speeds. The evolution of HBM DRAM has seen its advancements from ...
Micron Technology, Inc., has announced production sampling of its new 1Gb DDR2 device fabricated on 68-nanometer (nm) DRAM process technology. The new process, coupled with Micron’s 6F² technology, ...
TAICHUNG, Taiwan, Dec. 11, 2025 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the release of its new 8Gb DDR4 DRAM, ...
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